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ELECTRONICS AND REPAIRS

What is BGA reballing and when is it needed?

BGA procedure only makes sense after accurate diagnosis and confirmation of the actual cause of the failure.

01

What does BGA mean?

BGA is a way of connecting the chip and the printed circuit board via tiny solder balls. The problem may be in the connections, the chip or another part of the circuit.

02

What does the procedure look like?

Reballing involves removing the chip, preparing the contacts and reballing with new solder balls using the appropriate equipment.

03

It is not a universal solution

Before deciding on a repair, it is necessary to inspect the device, explain the possibilities and evaluate the profitability of the procedure.

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